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|
SEM |
FIB |
Electron/ Ion Gun
|
Tungsten heated filament
|
Ga liquid metal ion source
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Resolution
|
3.5 nm at 30 kV
|
<5 nm at 30 kV
|
| Magnification |
3× – 1,000,000× |
150× – 1,000,000× |
| Accelerating Voltage
| 200 V to 30 kV |
1 kV to 5 kV;
10 kV to 30 kV |
| Probe Current |
1 pA to 2 μA |
1 pA to 20 nA |
| Gun vacuum |
< 1 × 10-2 Pa |
< 5 × 10-6 Pa |
| Chamber Vacuum
|
< 1 × 10-2 Pa |
< 1 × 10-2 Pa |
| Scanning
|
| Working Modes |
Resolution, Depth, Field, Wide Field, Rocking Beam, 3D Beam Live stereoscopic imaging, E-Beam induced deposition*, E-Beam Litography |
Imaging, SEM-FIB Simultaneous Imaging, Etching, Polishing, Selective etching*, I-Beam induced deposition* |
| * Only if GIS option is installed |
| Scanning Features |
Focus Window, Dynamic Focus, Point & Linescan, Tilt Correction, 3D Beam, |
Focus window, Poin, Line, Rectangle, Circle, Ring, Staris, Bitmap, Text |
| Scanning Speed |
160 ns to 10 ms per pixel |
160 ns to 10 ms per pixel |
| Digital Output |
| Image size |
up to 8,192×8,192 pixels
|
| Bit Depth |
16-bits per channel
|
| System control |
| PC Control |
All functions are fully PC controlled by means of the LyraTC GUI software on a Windows™ platform |
| Controlers |
trackball |
Chamber XM |
| Internal Dimensions |
300 mm (width) x 300 mm (depth) |
| Door Size |
280 mm (width) x 310 mm (height) |
| Number of Ports |
9+ |
| Chamber Suspension |
pneumatic or optional active vibration isolation |
| Specimen Stage |
| Type |
5-axis fully motorized, compucentric |
| Movements |
X = 130 mm
Y = 130 mm
Z = 100 mm
Rot.: 360° continuous
Tilt*: -20° to +80°
|
| Maximum Specimen Height |
137 mm |
+ Standard number and configuration of ports can be modified to customer needs
* from WD 15 mm and for eucentric height of the specimen |
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| Detectors |
| SE Everhardt-Thornley |
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| Retractable BSE |
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| LVSTD |
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| TE Detector |
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| CL Detector |
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| EBIC |
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| EDX* |
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| EBSD* |
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| Accessories |
| Probe Current Measurement |
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| Touch Alarm |
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| IR Chamber View Camera |
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FIB Beam Blanker |
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| SEM Beam Blanker |
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| Gas Injection System* |
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| Active Vibration Isolation* |
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| Magnetic Field Cancelling System* |
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| Nanomanipulators* |
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standard, option, – not available
* Fully integrated third party tools |