Tescan s.r.o. - LYRA\ XMU FIB-SEM

Products – LYRA\ XMU

$LYRA\ XMU$

Focused Ion Beam Equipped
Scanning Electron Microscope with an Extra Large Chamber and Variable Pressure SEM Operation.

A unique four-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the Tescan proprietary Intermediate Lens for the beam aperture optimization
Fast imaging rate, using first class YAG detectors
Variable pressure mode for observation of nonconductive specimens in their natural uncoated state
Fully automated microscope set-up including electron optics set-up and alignment
Live stereoscopic imaging for accurate 3D navigation
Network operations and built-in remote access/diagnostics, all come as a Tescan standard
5-axis fully motorized compucentric stage with extra wide range of movements

FIB Specific Features

Unique ion optic column differentially pumped, with 2 ion pumps, for ultra-low ion scattering effect
Motorized aperture changer with ultra-high reproducibility
Beam Blanker and Faraday cup included as a standard
Simultaneous SEM imaging with FIB etching or deposition
FIB control is fully integrated in the SEM software
Powerful toolbox for basic shapes creation with programmable process parameters

GIS Option Features

Ideal geometrical configuration with respect to SEM and FIB columns
5 independent gas reservoirs with capillaries
3-axis microstage with automatic nozzles positioning
Automated temperature control

Standard Gases for GIS*:

Tungsten metal deposition
Platinum metal deposition
Insulator (SiO_x) deposition
Enhanced etching of diamond and PMMA (H2O)
Enhanced or selective etching of Si, SiO₂, Si₃N₄, W (XeF₂)

* Other gases upon request

The LYRA I XMU Essential Specifications:

	SEM	FIB

Electron/ Ion Gun	tungsten heated filament	Ga liquid metal ion source
Resolution	3.5 nm at 30 kV	<5 nm at 30 kV
Magnification	3× – 1,000,000×	150× – 1,000,000×
Accelerating Voltage	200 V to 30 kV	1 kV to 5 kV; 10 kV to 30 kV
Probe Current	1 pA to 2 μA	1 pA to 20 nA
Gun vacuum	< 1 × 10^-2 Pa	< 5 × 10^-6 Pa
Chamber Vacuum High Vacuum Mode Medium Vacuum Mode Low Vacuum Mode	< 1 × 10^-2 Pa 7-150 Pa 7-500 Pa	< 1 × 10^-2 Pa - -
Scanning
Working Modes	Resolution, Depth, Field, Wide Field, Rocking Beam, 3D Beam Live stereoscopic imaging, E-Beam induced deposition*, E-Beam Litography	Imaging, SEM-FIB Simultaneous Imaging, Etching, Polishing, Selective etching, I-Beam induced deposition
^* Only if GIS option is installed
Scanning Features	Focus Window, Dynamic Focus, Point & Linescan, Tilt Correction, 3D Beam,	Focus window, Poin, Line, Rectangle, Circle, Ring, Staris, Bitmap, Text
Scanning Speed	160 ns to 10 ms per pixel	160 ns to 10 ms per pixel
Digital Output
Image size	up to 8,192×8,192 pixels
Bit Depth	16-bits per channel
System control
PC Control	All functions are fully PC controlled by means of the LyraTC GUI software on a Windows™ platform
Controlers	trackball
Chamber XM
Internal Dimensions	300 mm (width) x 300 mm (depth)
Door Size	280 mm (width) x 310 mm (height)
Number of Ports	9⁺
Chamber Suspension	pneumatic or optional active vibration isolation
Specimen Stage
Type	5-axis fully motorized, compucentric
Movements	X = 130 mm Y = 130 mm Z = 100 mm Rot.: 360° continuous Tilt*: -20° to +80°
Maximum Specimen Height	137 mm
⁺ Standard number and configuration of ports can be modified to customer needs * from WD 15 mm and for eucentric height of the specimen

Detectors
SE Everhardt-Thornley
Retractable BSE
LVSTD
TE Detector
CL Detector
EBIC
EDX*
EBSD*
Accessories
Probe Current Measurement
Touch Alarm
IR Chamber View Camera
FIB Beam Blanker
SEM Beam Blanker
Gas Injection System*
Active Vibration Isolation*
Magnetic Field Cancelling System*
Nanomanipulators*
standard, option, – not available * Fully integrated third party tools

Wide Field Optics™ is the trademark of TESCAN, s.r.o.
Windows™ is the trademark of the Microsoft Corporation.
We are constantly improving the performance of our products, so all specifications are subject to change without notice.