High-resolution non-destructive 3D imaging of integrated circuits

Mar/16/2017
TESCAN Xe plasma FIB-SEM FERA3, an essential tool for sample preparation

X-ray ptychography - a high-resolution coherent diffractive imaging technique - was used to create three-dimensional images of complex multilayered integrated circuits with unmatched lateral resolution. The TESCAN FE-SEM Xe plasma FIB FERA3 system was used during the preparation process of the analysed samples.

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Slice of the detector ASIC.

Original source

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