High-resolution non-destructive 3D imaging of integrated circuits

TESCAN Xe plasma FIB-SEM FERA3, an essential tool for sample preparation

X-ray ptychography - a high-resolution coherent diffractive imaging technique - was used to create three-dimensional images of complex multilayered integrated circuits with unmatched lateral resolution. The TESCAN FE-SEM Xe plasma FIB FERA3 system was used during the preparation process of the analysed samples.

Slice of the detector ASIC.

Original source

Related news

TESCAN FIB-SEM LYRA3 used for TEM lamellae preparation in neutron damage studies
Beam-contamination-induced compositional alteration and its neutron-atypical...
Technical newsPR news
In Vitro Assessment of Early Bacterial Activity on Micro/Nanostructured Ti6Al4V Surfaces
TESCAN FIB-SEM LYRA3: Understanding interactions between bacteria genre and...
Technical newsPR news