TESCAN at FICS Research Conference on Cybersecurity

Mar/16/2017
The conferece was held at the University of Florida on March 7-8, 2017
Successful symposium at the University of Florida under the chaperoning of Prof. Mark Tehranipoor and Dr. Navid Asadi. Dr. Ed Principe from TESCAN USA was presenting a talk on Plasma FIB Deprocessing of Integrated Circuits from the Backside. It was impressive and well received talk highlighting TESCAN’s capabilities in delayering and its potential for applications in Cybersecurity.
 
During the conference there was an opportunity for attendees to visit the University facilities. Among others, TESCAN FERA3 and LYRA3 were presented.

Related news

Because everything needs to be just right
SAFINA, a.s. a company located right at the heart of Europe has developed...
Jul/26/2017
Sales newsPR news
TESCAN at the MMC 2017
We would like to extend our thanks to all customers and business partners...
Jul/11/2017
PR news
Understanding variability of metal additive parts
TESCAN Ga FIB-SEM LYRA3 used for preparation of electron-transparent TEM...
Jun/16/2017
PR news
TESCAN presence in the South-East Asian high-tech
TESCAN GAIA in Fabrinet – A Trusted Manufacturing Partner of the World...