TESCAN solution for large wafer inspection

Mar/09/2017
High Resolution Large Format Imaging for Die Inspection
 
Most of the inspection techniques currently in use are optical-based which will face a resolution limit due to the continual reduction in the size of dies. TESCAN’s Image Snapper is a perfect substitution allowing nondestructive imaging based on the stitching of high magnification images resulting in one high resolution panorama image.

Documents for download

High resolution large format imaging for die inspection
Visual inspection is an integral part of the production line in all semiconductor foundries. Most of the inspection techniques currently in use are optical-based which will face a resolution limit due to the continual reduction in the size of dies. TESCAN’s Image Snapper is a perfect substitution allowing nondestructive imaging based on the stitching of high magnification images resulting in one high resolution panorama image.
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