Software

Our dedicated modular software is especially designed to make the most of our microscopes regardless the application field or your level of expertise operating microscopes. The software enhances the capabilities of the systems enabling maximum control, speed, and excellent performance. From image acquisition to image analysis or from sample preparation to 3D sample reconstructions our software solutions deliver maximum throughput to your lab.

 
Software
User-friendly TESCAN software

ATLAS

ATLAS is a universal image processor for capturing, displaying, processing, analysing, searching, and archiving images obtained from different image sources such as electron microscopes or dual beam systems.
The program contains an image manager system allowing users to store their images in albums, find specific images or groups of images based on a variety of criteria such as acquisition date, microscope’s name, project’s name, operator’s name, microscope’s parameters for image acquisition, detector used, resolution, microscope’s operation mode, for acquiring the image, and more.
 
ATLAS runs on a Windows™ platform and can export files to MS Word simplifying in this way the creation of reports based on customisable templates. The images can be saved in a variety of standards formats (e.g. jpeg, tiff, bmp, etc.).  Atlas is multi-user software, thus each user’s environment and settings are saved after logging-off and automatically restored back on a new session. Built as a modular system, the functionalities of Atlas can be expanded by means of plug-in modules and according to particular analytical needs.
 
Standard modules tools in the ATLAS software include:
 
  • Histogram:  Allows displaying the image histogram equalisation of the active window. Contrast/brightness can be simply changed by three arrows (black or white level and gamma correction).
  • Live Video: Allows the user to process the image captured by means of a video camera or other image recording device connected to the PC. Help monitoring
  • Measurement: Intended for measuring lengths, areas or angles of objects in an image. The module can also insert descriptions, scale bars, markers, auxiliary arrows and set a grid over the image. The measurement results can be saved into a file which can be opened by a text or spreadsheet processor.
  • Particles: Module intended for morphological analysis of objects (particles, grains, fibres, etc.).
  • Hardness: Intended for measuring material hardness by means of the Brinell or Vickers method.
  • Image processing: Provides an extensive set of image editing functions - resizing and cropping, noise reduction filters, various edge and structure detectors, manual and automatic brightness and contrast adjustment functions and several colour enhancement filters.
  • Multi Image Calibrator: Allows the user to automatically calibrate the set of images, i.e. setting the pixel size. This information is used by other modules (e.g. Measurement) for the measurement of lengths or areas in physical units (millimetres, inches, nanometres, etc.).
  • Object Area: Intended for calculating areas selected in an image. The region is defined by the colour (brightness) of the pixels lying within the region. The region is set off with the selected colour and it is possible to calculate its area. The region must be distinguishable in brightness or colour shade. Various images can be processed at the same time, and the obtained results can be saved into a text file.
  • Tolerance: Intended for quick control of objects dimensions and dimensions tolerance.
  • Report Generator: Allows users to create printable documents based on predefined templates such as reports.

Synopsys AvalonTM

Synopsys is a correlative microscopy module for semiconductor applications which includes the AvalonTM software tool for CAD navigation, circuit edit and failure analysis in semiconductors.
This software is capable of reading and displaying the physical schematics and layout of a device such as an integrated circuit or a lithographic pattern. The CAD layout is displayed on top of the SEM/FIB image using the DrawBeam software as an interface. Avalon is an indispensable tool for electron/ion lithography applications and for all FIB applications such as modification of the sample either for the purposes of prototyping and circuit editing.
 

Key benefits:

  • Improves failure analysis productivity through a common software platform for various FA equipment
  • Significantly decreases time to market with reduced FA cycle time
  • Faster problem solving by cross-mapping between device nodes to view all three design domains (layout, netlist and schematic) simultaneously
  • Increases accuracy of FA root cause analysis using advanced debug tools
  • Single application that overlays images from various FA equipment on to design layout
  • Secure access to all FA information using KDB™ database
  • Design independent system that supports all major layout versus schematic (LVS)
  • Complete access to all debug tools critical to failure trace, circuit debug and killer defect source analysis
  • Simple deployment setup with support for Linux and Windows
  • Seamless integration with legacy Camelot™ and Merlin™ databases
  • Ease of conversion for layout, netlist and schematic data and establishes cross-mapping links between each data entity

Related Application Notes

Integrated circuit device modification using Camelot
As the complexity of Integrated Circuit (IC) design modifications increase, the time to perform these modifications also increases. As a result, the turn-around-time for bug fixes becomes critical to a product’s success. The Focused Ion Beam (FIB) is powerful tool for circuit edit because it can remove and deposit materials with high precision. These capabilities can be used to cut and connect circuitry within a device, as well as to create probe points for electrical test. To execute circuit edits, the FIB tool is coupled to a CAD navigation system that makes it possible to locate the area of interest.
pdf – 2.2 MB

AutoSlicer

AutoSlicer enables automation of FIB-SEM operations such as serial cross-sectioning and lamellae preparation or other objects defined at multiple locations. Overnight and unattended operations can be set.
The full automation of these processes helps to increase the productivity of the system and saves the operator’s effort. By defining multiple objects on multiple sites, the module allows for setting the process for overnight and unattended operation.

3D Tomography

3D Tomography is dedicated software for performing FIB-SEM tomography and the subsequent 3D reconstructions from the collected data.

Different visualisation methods are available and data post-processing is also possible.
 

The module consists of the following parts:

  • Milling and image acquisition wizard
  • Data post-processing
  • 3D reconstruction and visualization



 

Data Acquisition

The Acquisition Wizard guides the operator to set optimal milling and imaging parameters. The region of interest is selected in the FIB window and some parameters related to milling conditions, number of slices and resolution have to be set.
 

Automated Ion Milling & Image Acquisition

The first step in the preparation consists of creating an optional protective layer, milling a ditch of the given depth, and, preparing a polished initial cross-section. The ditch size is automatically set in order to prevent esti­mated redeposition effects and geometrical shadowing of the cross-section. A protective Pt layer is deposited in some cases, e.g. when a precise surface profile reconstruction is required, and in other cases can be switched off. The second step starts from the initial cross-section. A sequen­tial process of milling away thin slices of material followed by SEM image acquisition. The tilt correction, image shift and focus are automatically re-adjusted in order to keep the image of the polished surface at the centre of the view field. The whole process of data acquisition for a volume of approx. 10 × 10 × 10 μm3 can take about 2-3 hours (depending on the selected milling conditions).
 

Data Post-Processing

The acquired series of images are not always suited for a direct visualization without post-processing. This is why the images can be cropped, realigned and some additional filters can be applied (shading correction, median, etc.).
 

3D Visualization

Various visualization methods are available. The module can load a series of grayscale images or import raw binary data (dimensions, scale and file format are given by the user).

There are several visualization methods:

Isosurfaces



Multiple isosurfaces of different colours and transparencies can be shown. High-quality images are required for this method (low noise).

Direct volume rendering



In direct volume rendering the colour and opacity depends on the brightness value in the image. This algorithm is not so sensitive to noise or gradual changes in brightness as the isosurfaces method.

Slices



Multiple slices can be displayed, either aligned to a major axis or taken at arbitrary angles. A different colour map (palette) can be attached to each slice. The slices can be opaque, transparent to a given threshold or their transparency can be defined in the colour map.

Related Application Notes

FIB Tomography of an Integrated Circuit
FIB tomography has become an important tool for studying materials at the micro and nano scale. Unlike a single cross-section, FIB tomography gives better understanding of the volume distribution, 3D structure and the relationship between three dimensional objects. TESCAN FIB-SEMs can be equipped with 3D Tomography - an optional software module for automated data acquisition and reconstruction.
pdf – 1.4 MB
Ultra-Fast 3D EDS and 3D EBSD Microanalysis on the FERA Xe+ Plasma FIB-SEM
In this application example a first results of ultra-fast 3D EBSD and 3D EDS done on FERA FIB-SEM are shown. The three dimensional material microanalysis became a popular analytical method during the past few years, gaining from the ability to describe the material structure and composition as it exists in real components. A high resolution scanning electron microscope (SEM) combined with a focused ion beam (FIB) is used for a high precision tomographical method based on FIB slicing and SEM observation of the slice. The FIB-SEM can be further equipped by analytical methods like energy-dispersive X-ray spectrometer (EDS) for elemental composition or electron backscattered diffraction analyzer (EBSD) for crystal orientation mapping, resulting in 3D microanalysis, i.e. 3D EDS and 3D EBSD. However, the main limitation of this tomographic method so far has been the speed of data acquisition. This influences also the volume which can be analyzed in reasonable time of several hours.
pdf – 851 kB

CORAL

Correlative microscopy has become one of the leading approaches for comprehensive characterization of cellular functions.
The ability to correlate data obtained from multiple imaging modalities allows researchers to investigate relationships between the function and the structure as never before.

TESCAN offers a dedicated CORAL module as a comprehensive software tool for performing correlative microscopy experiments. It allows users easily import data from any source, easily correlate and overlay on top of an SEM image.

Correlative microscopy in a FIB-SEM system

CORAL module platform allows correlate data from light microscopy with FIB-SEM systems. It works in synergy with the DrawBeam FIB control software platform, where users can create structures directly in the DrawBeam environment. It takes into account tilt corrections so the same structures can be independently navigated in the FIB and SEM scanning windows.

Key Features:

  • Easy-to-use interface
  • Compatible with any light microscope
  • Direct import of complex LM data
  • Simple alignment of LM and SEM data
  • No special stage or holder necessary
  • Multiple navigation capabilities
  • Advanced ROI management
  • Works together with other software modules