FERA3 GM
GM Chamber
XE - Plasma FIB
A fully PC controlled SEM with Schottky field emission cathode in combination with gallium Focused Ion Beam (FIB) column and optionally with Gas Injection System (GIS). Oustanding optical properties, flicker-free digital image with super clarity, sophisticated user-friendly software for SEM/FIB/GIS control and image capturing using Windows platform, standard formats of stored images, easy image management, processing and measurements, automatic set up of the system and many other automated operations are characteristic features of the equipment.
Analytical Potential
- High brightness Schottky emitter for high-resolution / high-current / low-noise imaging
- Extraordinary resolution with powerful optional In-Beam SE Detector
- Unique three-lens Wide Field Optics™ design offering the variety of working and displaying modes embodying the TESCAN proprietary Intermediate Lens (IML) for the beam aperture optimization
- Real time In-Flight Beam Tracing™ for the performance and beam optimization integrating the well-established software Electron Optical Design. It includes also direct and continual control of beam spot size and beam current
- Fast imaging rate
- Beam Deceleration Technology (BDT) for excellent resolution at low beam voltages (optional)
- In-Beam BSE Detector for BSE imaging at very short working distances (optional) suitable even for ferromagnetic samples imaging
- High-throughput large-area automation, e.g. automated particle location and analysis
- Superior specimen handling using a motorized compucentric stage
- Ideal geometry for EDX and EBSD; non-distorted EBSD pattern
- Fast and easy obtaining of the clean chamber vacuum by powerful turbomolecular and dry fore vacuum pump; electron gun pumping by ion getter pump
- Fully automated microscope setup including electron optics setup and alignment
- Network operations and built-in remote access/diagnostics, all come as the TESCAN standard
- Unique live stereoscopic imaging utilizing the 3D Beam Technology
- Extended low vacuum mode with chamber pressure up to 500 Pa for non-conducting specimens imaging
- Unique ion optic column differentially pumped (2 ion getter pumps) for ultra-low ion scattering effect
- Motorized aperture changer in ion column with ultra-high reproducibility
- Beam Blanker and Faraday cup included as standard accessories for ion column
- Ultra-high resolution and excellent performance at high current with optional Cobra column
- Automatic FIB cutting and signal acquiring followed by 3D reconstruction (tomography), allowing 3D EBSD, 3D EBIC etc. with integrated 3D visualization
- Sophisticated software for SEM/FIB/GIS control, image acquisition, archiving, processing and analysis; multi-user environment localized in many languages
FERA3 Configurations
The GM configurations extend their analytical capabilities, providing the capability to perform fine sample surface observation and modification even with extra-large specimens.
FERA3 GMH
These extra-large chamber models with compucentric motorized manipulators operate at high vacuum for the investigation of conductive samples with extraordinary imaging quality.
FERA3 GMU
These variable pressure SEM models supplement all the advantages of the high-vacuum model with an extended facility for low-vacuum operations, enabling the investigation of non-conductive specimens in their natural uncoated state.
Software extensions:
All microscope functions are controlled by keyboard, mouse and trackball via the program FeraTC using Windows™ platform.
Standard:
- Measurement
- Image Processing
- 3D Scanning
- Hardness
- Multi Image Calibrator
- Object Area
- Switch-Off Timer
- Tolerance
- Positioner
- Live Video
- DrawBeam Basic
- EasySEMTM
Optional:
- Particles Basic
- Particles Advanced
- Sample Observer
- Image Snapper
- Input Director
- TESCAN TRACE GSR
- 3D Metrology (MeX)
- 3D Tomography
- System Examiner
- 3D Tomography Advanced 1
- 3D Tomography Advanced 2
- Cell Counter
Electron Optics:
| Electron Gun: | High brightness Schottky emitter | ||||||||||||||
| Resolution: |
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| Magnification: | at 30kV: 1x– 1,000,000x | ||||||||||||||
| Maximum Field of View: | 6.0 mm at WDanalytical 9 mm | ||||||||||||||
| Accelerating Voltage: | 200 V to 30 kV/50V to 30 kV with BDT option | ||||||||||||||
| Probe Current: | 2 pA to 200 nA | ||||||||||||||
| Electron Optics Working Modes: |
Available modes in low vacuum are Resolution and Depth. |
Scanning:
| Scanning Speed: | From 20 ns to 10 ms per pixel adjustable in steps or continuously |
| Scanning Features: | Point & Line Scan |
Ion Optics:
| Ion column: | i-FIB |
| Resolution: | 25 nm at 30kV at SEM-FIB coincidence point |
| Magnification: | minimum 150x at coincidence point and 10 kV (corresponding to 1 mm view field), maximum 1,000,000x |
| Accelerating Voltage: | 3 kV to 30 kV |
| Ion Gun: | Xe Plasma Ion Source |
| Probe Current: | 20 pA to 2 μA |
| SEM-FIB Coincidence at: | WD 9 mm for SEM - WD 12 mm for FIB |
| SEM-FIB angle: | 55° |
Vacuum System:
| Chamber Vacuum: |
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| Gun Vacuum: | < 3x10-7 Pa | ||||
| FIB gun Vacuum: | < 5x10-4 Pa | ||||
| Pumping Time after Specimen Exchange: | typically < 3.5 minutes |
* pressure < 5x10-4 Pa reachable
** with low vacuum aperture inserted
Chamber:
| Internal diameter: | 340 mm (width) x 315 mm (depth) |
| Door: | 340 mm (width) x 320 mm (height) |
| Number of ports: | 20+ |
| Chamber Suspension: | Standard: active vibration isolation (integrated) |
Specimen Stage:
| Type: | Compucentric, fully motorized |
| Movements: | X = 130 mm (–65 mm to +65 mm) Rotation: 360° continuous Note: Range of the movements can be dependent on WD and configuration. |
| Maximum Specimen Height: | 92 mm (with BDT rotation stage) |
Standard:
- SE Secondary electron detector Everhart-Thornley type (YAG Crystal)
- Retractable BSE* Retractable annular backscattered electron detector scintillator type (YAG crystal) with high sensitivity and atomic number resolution (0.1)
- pA Meter Probe Current Measurements
- Touch Alarm Stops movements when sample touches any part of the chamber
- IR TV Camera For live „Chamber View“
- In-Beam BSE detector Annular scintillator based backscattered electron detector (YAG crystal) mounted in-column that enables to obtain BSE images at very short working distances and imaging of the milling process at the highest FIB current
Optional:
- In-Beam SE Detector
- Detector of secondary electrons located in the objective and intended for high resolution and short working distances
- LVSTD (up to 500 Pa)1
- Original SE detector for low vacuum operations, modified Everhart-Thornley type, U.S. Patent No. 7,193,222 B2
- SITD Secondary Ion TESCAN Detector; possible simultaneous SE and SI acquisition
- Beam Deceleration Technology (BDT) package - Intended for the highest resolution at low beam voltages includes system for negative voltage biasing of the sample stage and new in-beam detector that works either as SE detector (in BD mode) or BSE detector (in standard mode). BDT package includes decontaminator as standard.
- Beam Deceleration Technology (BDT) option - Intended for the highest resolution at low beam voltages includes system for negative voltage biasing of the sample stage and new in-beam detector that works either as SE detector (in BD mode) or BSE detector (in standard mode). This option does not include decontaminator.
- Retractable Dual Scintillator BSE Detector*
- STEM Detector Transmitted electrons detector; Bright Field and Dark Field imaging
- CL Detector* Panchromatic cathodoluminescence detector, two wavelength ranges available: 350 nm – 650 nm; 185 nm – 850 nm
- Color CL Detector* Color cathodoluminescence detector. RGB image processing is fully integrated in microscope control software; No external scanning, wavelength range 350 nm – 850 nm
- EBIC Electron beam induced current detection
- SPM Scanning probe microscope (AFM or STM modes), easy to install on the SEM stage, simultaneous SPM/SEM work possible
- EDX** Take off angle: 25° at SEM WD 9 (coincidence point)
- WDX** Take off angle: 35° at SEM WD 9 (coincidence point)
- EBSD** Electron backscattered diffraction, ideally positioned to work at SEM WD 9 (coincidence point)
1 Available only for GMU version.
* motorized mechanics as an option
** fully integrated third party products
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