Ensure Reproducible Cross-Sections and 3D Reconstructions for Confident Materials Analysis 

Obtain reproducible nanoscale diffraction and imaging data for advanced materials analysis. Tescan TENSOR integrates 4D-STEM with beam precession, direct electron detection, and synchronized EDS for robust phase and orientation mapping.

Automated workflows reduce user variability and minimize beam damage, while multimodal integration ensures correlation between crystallography, chemistry, and morphology.

Enable reliable nanoscale insights that advance alloy development, ceramic studies, and battery electrode research.

Create and test nanoscale devices with reproducible precision in a single instrument. Tescan FIB-SEM systems support direct-write lithography, focused ion beam patterning, and nanoscale machining for flexible prototyping.

Integrated gas injection systems enable customized structures, while in-situ SEM imaging ensures real-time process control and repeatable outcomes.

Accelerate research in MEMS, quantum materials, and sensor development with reproducible nanoscale prototyping workflows.

Visualize internal structures without sectioning to preserve material integrity. Tescan micro-CT systems provide full-volume scans with targeted zooms and dynamic in-situ CT for structural evolution under load, heat, or cycling.

Spectral imaging modes enhance material contrast and phase differentiation, while automated reconstruction ensures repeatable, high-fidelity datasets.

Deliver reproducible 3D insights that strengthen materials design, additive manufacturing validation, and failure prevention strategies.

Obtain consistent surface imaging and compositional data across diverse material types. Tescan SEM platforms offer high-resolution imaging at low voltages, variable pressure modes for non-conductive samples, and seamless EDS integration.

Smart automation and advanced detectors ensure reproducible contrasts and efficient workflows, from morphology to large-area microanalysis.

Generate reliable datasets that accelerate surface engineering, quality assurance, and materials discovery.

Prepare site-specific, damage-free samples for advanced analysis with confidence. Tescan FIB-SEM systems enable automated TEM lamella preparation, low-keV polishing, and site-specific lift-out for high-quality results.

Plasma FIB with TRUE X-sectioning minimizes amorphous damage, while automation ensures reproducibility across multi-user labs and industrial settings.

Deliver reliable TEM and APT specimens that advance nanoscale analysis and support critical decision-making in materials development.