The cold drawing process used to produce metal wires causes the development of a fibrous microstructure and crystallographic texture, which is accompanied by increased hardness and electrical resistivity along the applied deformation. For this reason, the cold drawing should be followed by short annealing. However, some anisotropy remains, depending on the level of deformation. The evaluation of the texture requires an SEM-based crystallography technique, the Electron Back-Scattered Diffraction (EBSD), and a high-quality sample preparation.
A favourable combination of high-performance TESCAN S8000X Xe+ plasma FIB-SEM, TESCAN’s unique geometry for static 3D EBSD, beam spot optimization, and high-speed EBSD camera enables performing large-volume 3D EBSD sample characterization in minimum time frames.
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