As the first SEM manufacturer to commercialize integrated xenon plasma FIB with the SEM, TESCAN proudly announces TESCAN AMBER X.
TESCAN AMBER X is a new FIB-SEM solution that combines high throughput plasma-assisted ion milling with improved ultra-high resolution (UHR) field-free SEM optics, a combination ideally suited for materials characterization over a significantly wider sample range. TESCAN AMBER X target applications include milling and characterization of large cross-sections (up to 1 mm in width), multiscale, multi-modal FIB-SEM tomography, and contamination-free preparation of micro- and nano-structures for subsequent testing or characterization.