The overview image using chamber SE detector at 2 kV shows the MEMS cross-section with a metallic bonding layer.
Microelectromechanical systems (MEMS) are commonly used as actuators, sensors, radio frequency and microfluidic components throughout a variety of applications in health care, automotive and military industries. However, there are considerable challenges with both the fabrication and packaging of such devices. In particular, issues related to yield and reliability need to be overcome.
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