Cross-sections milled by Ga FIB are typically on the several tens of microns, width and depth. However, for structures such as displays, TSVs, MEMS, BGAs, or flip-chips, which may require extra-large cross-sections for failure analysis, a plasma ion column is the preferred solution for milling. TESCAN SOLARIS X FIB-SEM equipped with iFIB+™ Xe plasma FIB column delivers the high currents needed to speed material removal for large cross-sections.
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