Characterization of metal wires with the new TESCAN S8000X Xe+ plasma FIB-SEM

Dec/17/2018
Microstructure Anisotropy Study of Cold-Drawn Wires using 3D EBSD and Xe+ Plasma FIB
The cold drawing process used to produce metal wires causes the development of a fibrous microstructure and crystallographic texture, which is accompanied by increased hardness and electrical resistivity along the applied deformation. For this reason, the cold drawing should be followed by short annealing. However, some anisotropy remains, depending on the level of deformation. The evaluation of the texture requires an SEM-based crystallography technique, the Electron Back-Scattered Diffraction (EBSD), and a high-quality sample preparation.
A favourable combination of high-performance TESCAN S8000X Xe+ plasma FIB-SEM, TESCAN’s unique geometry for static 3D EBSD, beam spot optimization, and high-speed EBSD camera enables performing large-volume 3D EBSD sample characterization in minimum time frames.

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Application Example

Microstructure Anisotropy Study of Cold-Drawn Wires using 3D EBSD and Xe+ Plasma FIB
Wires commonly used in the electronic industry are usualy prepared by cold drawing from a thicker wire. The drawing process causes the development of a fibrous microstructure and crystallographic texture, accompanied by increased hardness and electrical resistivity along the applied deformation. Therefore the cold drawing should be followed by short annealing, however some anisotropy remains, depending on the level of deformation.
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