Non-destructive inspection of semiconductor devices

May/23/2018
High resolution large format imaging for die inspection with TESCAN Image Snapper Software
Visual inspection is an integral part of the production line in all semiconductor foundries. Most of the inspection tech­niques currently in use are optical-based which will face a resolution limit due to the continual reduction in the size of dies. TESCAN’s Image Snapper is a perfect substitution allowing non-destructive imaging based on the stitching of high-magnification images resulting in one high-resolution panorama image.
 
Download the new TESCAN Application Example and find out more on this.

The final high resolution panorama image consisting of 527 single images provides a very detailed overview of the entire die
The final high resolution panorama image consisting of 527 single images provides a very detailed overview of the entire die

Application Example

High resolution large format imaging for die inspection
Visual inspection is an integral part of the production line in all semiconductor foundries. Most of the inspection techniques currently in use are optical-based which will face a resolution limit due to the continual reduction in the size of dies. TESCAN’s Image Snapper is a perfect substitution allowing nondestructive imaging based on the stitching of high magnification images resulting in one high resolution panorama image.
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