Redefining large-area FIB cross-sectioning with the new TESCAN S8000X plasma FIB-SEM

Dec/10/2018
Physical Failure Analysis in a MEMS motion sensor: 1 mm-wide cross-section
Microelectromechanical systems (MEMS) can be defined as miniaturised mechanical and electromechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. There are, however, considera­ble challenges in the fabricating and packaging such devices. Diverse issues related to yield and reliability need to be overcome. For this purpose, large-area cross-sections at specific locations on the MEMS device need to be prepared. The new TESCAN S8000X is a Xe ion plasma focused ion beam scanning electron microscope (FIB-SEM) that provides an effective solution to prepare artefact-free large-area cross-sections on MEMS for the purposes of failure analysis of these devices. 

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Application Example

Physical Failure Analysis in a MEMS motion sensor 1 mm wide cross section
pdf – 1.3 MB