TESCAN AMBER X | New Plasma FIB Field-Free UHR FE-SEM

Sep/02/2019
A unique combination of plasma FIB and field-free UHR FE-SEM for the widest range of materials characterization applications.

As the first SEM manufacturer to commercialize integrated xenon plasma FIB with the SEM, TESCAN proudly announces TESCAN AMBER X.

TESCAN AMBER X is a new FIB-SEM solution that combines high throughput plasma-assisted ion milling with improved ultra-high resolution (UHR) field-free SEM optics, a combination ideally suited for materials characterization over a significantly wider sample range. TESCAN AMBER X target applications include milling and characterization of large cross-sections (up to 1 mm in width), multiscale, multi-modal FIB-SEM tomography, and contamination-free preparation of micro- and nano-structures for subsequent testing or characterization.

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TESCAN AMBER X
TESCAN AMBER X