Characterization of metal wires with the new TESCAN S8000X Xe+ plasma FIB-SEM
Microstructure Anisotropy Study of Cold-Drawn Wires using 3D EBSD and Xe...
Advanced failure analysis in FinFET-based devices with the new TESCAN S9000G FIB-SEM
Gas-assisted gallium FIB delayering of sub-20 node technologies with TESCAN...
Redefining large-area FIB cross-sectioning with the new TESCAN S8000X plasma FIB-SEM
Physical Failure Analysis in a MEMS motion sensor: 1 mm-wide cross-section
FIB-SEM Tomography of Biological Specimens with the new TESCAN S9000G
Advanced Focused Ion Beam-Scanning Electron Microscopy for 3D ultrastructural...
Nanostructured composite analysis in automotive industry with TESCAN instruments
Nanocomposite Kaolin/TiO2 as a Possible Functional Filler in Automotive Brake...
Advanced preparation of ultra-thin TEM specimens with the new TESCAN S9000G FIB-SEM
Ga FIB TEM sample preparation from a 10 nm FinFET device
Comparative study of plasmonic antennas
Fabrication of plasmonic structures by electron beam lithography using the...
Studying the ultrastructure of wood with TESCAN LYRA3 FIB-SEM
FIB-SEM tomography of spiral thickening in wood
Morphological characterization of nanostructures with the TESCAN MIRA3 FEG-SEM
Nanoparticles imaged with the TESCAN MIRA3 at 10 kV and up to 1,000,000...

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Multi-national company established by the merger of the Czech company TESCAN and the French company ORSAY PHYSICS.
Q-PHASE for quantitative phase imaging (QPI)

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