Focused ion beam scanning electron microscopy (FIB-SEM) combines two beams (electron and ion) in one instrument. The SEM column provides high resolution imaging, while the FIB column enables the modification of the samples. A dual beam FIB-SEM system opens up a world of new capabilities enabling such applications which would otherwise not be possible to achieve with either of the standalone systems.
The configuration in FIB-SEM systems is such that the electron and ion beam focal points coincide, which results in the optimisation of many applications. Such a feature enables simultaneous SEM imaging during FIB milling tasks – a significant leap in terms of performance and throughput in all those FIB operations which demand ultimate levels of precision. The TESCAN FIB-SEM systems portfolio comprises LYRA3 and GAIA3 both Ga ion source FIB for high precision milling tasks, as well as FERA3 and XEIA3, the Xe plasma FIB options for large-scale milling applications. In addition, the newly developed high resolution Xe plasma FIB achieving resolution of less than 15 nm extends the patterning capabilities of Xe plasma FIB technology.

The newest TESCAN FIB-SEM system is the TESCAN S8000G which is equipped with the BrightBeam™ SEM column for field-free ultra-high resolution imaging, and the novel Orage™ Ga FIB column with improved resolution and performance at low beam energies. Such combination makes the TESCAN S8000G a truly versatile and powerful analytical platform aimed for high-end applications in both academia and industry that require the ultimate in sample preparation.  

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