The TESCAN AMBER has all that it takes to meet the demands of today’s research in both industry and academia. It delivers outstanding image quality with superb contrast ideal for nanocharacterization and the capability to perform complex nanoengineering tasks with extreme precision and incomparable ease.

The TESCAN AMBER, fitted with a new SEM column - the BrightBeamTM, provides the benefit of versatility packaged with field-free ultra-high resolution imaging, including the analysis of magnetic samples and live SEM monitoring of your FIB operations. On the other hand, the synergy of a novel OrageTM FIB column fitted with state-of-the-art ion optics and the gas injection system, makes the TESCAN AMBER a world-class instrument for sample preparation and nanopatterning.

Modular and workflow-oriented software assures maximum control in all your applications and no trade-offs between complex technology and user-friendliness. The TESCAN AMBER is ideal for high-end FIB-SEM applications and, the analytical platform of choice, for all who pursue a better understanding and breakthroughs in science and technology on daily basis.

Key features

New BrightBeam™ SEM column technology for uncompromised UHR

  • New BrightBeam™ SEM column with proprietary 70° combined electrostatic-magnetic objective lens for maximum universality.
  • Field-free ultra-high resolution imaging for maximum versatility in imaging and analysis including the analysis of magnetic samples and live SEM imaging during FIB operations.
  • New detection system including In-Beam Axial detector and Multidetector for angle-selective and energy-selective signal collection gives complete control on surface sensitivity and the option to explore with different contrast.
  • New generation of electronics with up to 8 live signal channels simultaneously.
  • New Field Emission Schottky electron gun now enabling beam currents up to 400 nA, and rapid beam energy changes.
  • EquiPower™ lens technology for efficient thermal power dissipation and excellent electron column stability.
  • Beam Deceleration Technology (BDT) for further improved resolution at low and ultra-low electron beam energies with simultaneous detection of SE and BSE signals. (optional)


Novel Orage™ Ga FIB column for the most challenging nanoengineering tasks

  • Novel Orage™ Ga FIB column for ultra-high resolution ion beam and excellent performance throughout the entire range of ion beam currents and full energy range down to 500 eV. Resolution < 2.5 nm at 30 keV.
  • World-class quality in sample preparation with excellent performance at low energies for preparing damage-free ultra-thin TEM specimens.
  • High FIB currents up to 100 nA and SmartMill strategy for fast large-volume milling and slash by half the time for completing your cross-sectioning and lamella lift-out processes.
  • Fast FIB nanotomography for unique ultra-structural information of samples.
  • New single gas injection system OptiGIS with fast run up time and excellent stability of the deposition/etching rate. Up to 6 OptiGIS units is possible in one instrument.
  • Combination of field-free SEM imaging and high FIB currents allow fast and uninterrupted milling/imaging sequences and advanced recipes for TEM/atom probe sample preparation or FIB-SEM tomography.


Semiconductors & Microelectronics

Materials Science

Life Sciences