Scanning Electron Microscopes (SEM)
Tescan's SEM platforms provide high-resolution imaging and surface analysis with exceptional contrast, detail, and ease of use — ideal for materials research, quality control, and analytical applications.
WEBINAR | Correlated Microanalytical Workflows for Particle Analysis Using Automated Mineralogy, FIB-SEM and SIMS
From the surface to the atomic scale — and deep inside complex materials — Tescan gives you the tools to see more, understand faster, and go further. Our imaging and analytical systems empower breakthroughs across materials science, semiconductors, batteries, life sciences, and natural resources.
Tescan's SEM platforms provide high-resolution imaging and surface analysis with exceptional contrast, detail, and ease of use — ideal for materials research, quality control, and analytical applications.
Tescan's FIB-SEM systems combine fast, precise milling with high-resolution imaging and advanced automation. Choose from Ga+ or Xe plasma FIB sources to match your needs in sample prep, prototyping, or failure analysis.
Tescan's X-ray micro-CT systems deliver fast, high-resolution 3D and 4D imaging for non-destructive internal analysis. Dynamic in-situ capabilities and modular designs make them ideal for advanced research across materials, life sciences, and energy storage.
Tescan's TENSOR™ is the first fully integrated and synchronized analytical STEM platform built for intuitive multimodal nanocharacterization of a wide variety of samples, combining structural, morphological, and chemical insights. It is optimized for high-resolution crystallographic and structural analysis enabling full microscope automation, on-the-fly data processing for interactive analysis of samples, and scripting of new workflows that all together make it ideal for both routine and advanced research.
FemtoChisel™ is the next-generation femtosecond laser solution built specifically for semiconductor sample preparation and failure analysis. For too long, the industry has had to compromise between throughput, precision, and surface quality. Now all are delivered on one integrated platform.
Tescan EXLO™ is designed for laboratories where TEM throughput, reproducibility, and cost efficiency matter. By moving specimen lift-out outside the FIB-SEM, EXLO™ keeps valuable beam time focused on milling, while parallelizing lamella transfer and grid mounting. The result: higher output, lower cost per specimen, and a more efficient workflow.
Tescan's advanced systems support operation under demanding conditions — from controlled ion implantation to analytical tasks performed in ultra-high vacuum environments — while offering the freedom to customize system configuration and workflows to your specific research needs.
Purpose-built nanomanipulator for repeatable TEM/STEM and APT lift-out
Expandable software module for high-precision nanopatterning and nanofabrication applications
Imaging Insulating Samples Without Compromise
Beyond Conventional Materials Science: Design, Create and Analyse Next Generation Sensors and Devices
Navigate by true color, image correlation, or unseen marks beyond SEM contrast
High-throughput, artifact-free cross-sectioning with continuous visibility of the milling front, enabling accurate end-pointing, faster 3D tomography, and pristine results even at high FIB beam currents.
Ripple-free plasma FIB cross-sectioning without sacrificing speed or beam current
High-resolution 3D insight for complex materials
AI-driven, fully automated TEM/STEM preparation for both Ga and plasma FIB that stays reliable, repeatable, and accurate on any sample type.
Tescan
Libušina třída 21
623 00 Brno
Czech Republic
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