Events & webinars

Connect with microscopy experts and advance your research through Tescan events and webinars. Join hands-on training sessions, application workshops, and networking opportunities worldwide.

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Upcoming Events

Mar 25

Shanghai, China

Tescan Failure Analysis Solutions for Advanced Semiconductor Packaging at SEMICON China 2026

SEMICON China 2026 brings semiconductor failure analysis and advanced packaging under one roof. From March 25 to 27 in Shanghai, meet Tescan at booth number T4-4446  and see how an integrated semiconductor failure analysis workflow helps you move from defect discovery to verified root cause with speed, precision, and clear correlation.

Mar 31

Warrendale, Pennsylvania, USA

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Upcoming Webinars

Mar 31

Tailored Cryo-EM and Correlative Workflows for Challenging Biological Projects

From Open-Access Infrastructure to High-Impact Correlative and Cryogenic EM Projects at The Institute of Molecular Genetics of the Czech Academy of Sciences, Prague.

Apr 14

Improved TEM Specimen Quality and Lab Throughput with New AMBER 2 Ga⁺ FIB-SEM

Achieving lattice-level S/TEM quality requires more than experience-driven adjustments. This webinar introduces Tescan’s new integrated Ga⁺ FIB and gentle ion polishing solution designed to improve workflow consistency, and deliver faster, reproducible nanoscale results.

Apr 29

FemtoChisel™: Redefining Ultrafast Laser Processing

For years, lasers were dismissed as rough micromachining tools - fast but messy - leaving surfaces that required heavy post-processing and limiting their role in advanced semiconductor workflows.

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Past Webinars

Mar 17

Dynamic-to-Detail Micro-CT with Tescan UniTOM® HR 2

Tescan specialists show how Tescan UniTOM® HR 2 enables Dynamic-to-Detail micro-CT, allowing you to capture fast structural evolution and then investigate the same region in higher resolution without removing the sample.

Feb 26

Engineering Diamond Material with Focused Ion Beam Implantation for Quantum Technologies

Diamond is rapidly emerging as a key material for quantum technologies, driven by nitrogen-vacancy (NV) centers that enable optical readout and spin control with long coherence times at room temperature.

Jan 28

From Infrastructure to Impact: The Full Potential of Electron Microscopy and Micro-CT Solutions in Core Facilities in Materials

Core facilities support many departments on the same instruments, often without growing staff or budgets. This session brings together SpinLab Katowice and TU Graz to share practical approaches to running multi-user microscopy and micro-CT environments with faster time to data, efficient training, and consistent performance.

Dec 16

Up to 40% Faster Automated TEM Lamella Preparation with the Orage™ 2 Gallium FIB Column

Advanced semiconductor nodes demand ultra-thin, site-specific TEM samples. Manual preparation is slow, complex, and highly dependent on expert operators.

Nov 28

Precision Redefined: Enhancing APT Workflows with Next-Generation Plasma FIB-SEM Tescan AMBER X 2

Modern materials research demands a multiscale understanding of materials from the large-scale datasets to the 3D nanoscale resolution enabled by the Atom Probe Tomography method.

Nov 20

Nanoscale Prototyping with Advanced SEM Capabilities

Turn your SEM into a nanofabrication powerhouse. Learn how researchers are patterning, depositing, and etching at the nanoscale–fast–using Tescan’s Nanoprototyping Toolbox and advanced SEM workflows.Shape

Oct 14

EXLO in Action: Fast, Reliable and Scalable TEM Specimen Preparation

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

Aug 28

Proven to Lead: Advancing TEM Sample Preparation with Tescan AMBER X 2 Plasma FIB-SEM

University of Sydney and Tescan demonstrate how plasma FIB-SEM delivers both high-volume 3D characterization and precise TEM specimen preparation in a single universal system.

Jul 15

TESCAN TIMA Integration with Geometallurgy Test Programs

Geometallurgy combines geological, mineralogical, and metallurgical data to predict how ore variability affects processing. This integrated approach improves resource modeling, reduces operational risk, and supports more efficient, sustainable, and profitable mining decisions.

Apr 15

From Routine to Remarkable: Meet TESCAN MIRA XR

Experience how MIRA XR's advanced capabilities transform your analysis workflows in real-time demonstrations. Connect with Tescan experts to discover practical applications that enhance your research and quality control processes.

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