Failure analysis of microelectronic devices – WEBINAR
This includes unique techniques for planar delayering and TEM lamella preparation achieved with Ga and Xe plasma ion sources. Achievements in failure analysis of advanced packaging technologies by means of large-scale cross-sections performed with Xe plasma FIB will be also discussed.
The webinar will take place on Wednesday, May 4, 2016, from 3:00 PM – 4:00 PM CEST and on Thursday, May 5, 2016, from 8:00 AM – 9:00 AM CEST.
To join the seminar, please go to the webinar link, select the time of your convenience and fill in the registration form.
We look forward to your participation!
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