Combination of TESCAN VEGA Image Snapper and TESCAN Essence™ GUI provides a powerful solution that allows users to acquire large-area, panoramic images of the whole semiconductor dies or to collect standalone frames.
This brilliant “couple” allows visualization of small details at the diffusion level to give users a full understanding of die architecture. That information may be used in reverse engineering when the final goal is to reconstruct a device’s schematics to investigate a possible violation of a patented solution.
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