TESCAN is proud to be a Platinum Sponsor of M&M 2021!
We hoped to see you in person at M&M 2021, in our hometown of Pittsburgh. As this is still not possible, we’ve worked hard to prepare a robust virtual program, and hope that you’ll join us for our presentations and demonstrations, or just drop in for a chat!
LIVE PRESENTATION SCHEDULE
Join our Spatial Chat room for live presentations by TESCAN product specialists, and enter to win an Apple Watch!
In just 15 minutes you can learn about how TESCAN can help you achieve your application goals.
As an additional bonus – when you attend any of our presentations you will be sent a TESCAN bottle opener that can be redeemed for a free beer (or beverage of your choice) the next time you see a TESCAN representative!
WEDNESDAY
August 4 at 12:30 pm ET
TEM lamella preparation – steps towards fully automated process | Lukáš Hladík
TEM lamella preparation is the predominant application for FIB-SEM instruments in materials science and in semiconductor failure analysis. Thus, automation is valuable for improving time to final analytical results, particularly when multiple samples are being prepared or when the FIB-SEM tool is operated by a less experienced user.
Join our presentation to learn about new TESCAN AutoSlicer™ module which automates the initial steps in the TEM sample preparation workflow and guide users through lift-out and attachment of the lamella to the TEM grid.
WEDNESDAY
August 4 at 1:30 pm ET
Pushing the limits of time-resolved CT – TESCAN Dynamic micro-CT | Wesley De Boever, PhD
We will show how dynamic micro-CT at temporal resolutions below 10 seconds can provide unique insights in events and dynamic processes. TESCAN’s Dynamic Micro-CT systems enable experiments in your own lab, that were previously only available at synchrotron beam-lines. The presentation will give an overview of state-of-the-art experiments in the fields of material sciences and geosciences, and provide insights on how dynamic micro-CT can drive your own research.
THURSDAY
August 5 at 11:00 am ET
Automated delayering on the state-of-the-art semiconductor devices | Lukáš Hladík
Device delayering is the crucial first step in the physical failure analysis process of the state-of-the art semiconductor nodes. Join this presentation to learn about how TESCAN Delayering module for TESCAN Plasma FIB-SEM maximizes instrument time and lab resources while also improving sample throughput with pre-programmed recipes for unattended delayering – newly, on areas up to 300×300 µm2. Following delayering, the device is ready for SEM-based in-situ nanoprobing or electrical characterization.
THURSDAY
August 5 at 12:00 pm ET
TESCAN 3D FIB-SEM tomography of biological samples | Martin Sláma
Current trends in electron microscopy include increased focus on the analysis of beam-sensitive biological materials such as tissue or cell cultures. Modern SEM column designs are able to acquire images at very low accelerating energies which are key for efficient visualization of these sensitive biological samples at scales approaching the nanometer range.
Combining scanning electron microscopy with the site-specific milling capability of the focused ion beam (FIB) opens a broader range of possibilities for studying biological samples. FIB-SEM systems are widely used not only for routine preparation of ultra-thin specimens for analysis in the transmission electron microscope (TEM) but also for precise cross-sectioning and 3D volume imaging in both ambient temperatures and cryogenic conditions. FIB milling is used extensively to reveal sub-surface information from bulk material or to create samples for other analytical modalities. Using FIB-SEM for 3D tomography is a powerful technique in structural biology for enabling visualization of diverse organelles and tiny structures which helps researchers answer questions about the principles of biological processes.
In the presentation, we will discuss the capabilities of FIB-SEM solutions for detailed structural analysis of biological samples, including recent trends for using plasma-based FIB-SEM solutions to revealing the highest details in large volume sample analyses.
M&M SCIENTIFIC PROGRAM
Curious about our micro-CT systems?
TESCAN’s dynamic micro-CT solutions offer real-time, in-situ observation of complex physical processes, such as compression, torsion, tension, flow, heating, cooling, growth, dissolution, and many other dynamic events. The unique designs of our micro-CT systems can open the door to a new perspective on your research.
Tuesday, August 3
- 12:30 – 1:30 pm ET | Dynamic X-ray micro-CT insights of the recovery of ore bodies in presence of clay
- 5:15 – 6:45 pm ET | Can an iPhone save your life? Multimodal forensic analysis of bullet damage to a smartphone
Wednesday, August 4
- 2:15 – 3:15 pm ET | Time-resolved dynamic micro-CT imaging of food products in the lab
Thursday, August 5
- 12:45 – 1:45 pm ET | In situ dynamic X-ray micro-CT for additive manufactured parts
INTERESTED IN A PRODUCT DEMO?
TESCAN applications specialists will be providing virtual demonstrations of select SEM and FIB-SEM systems, and we invite you to register to see our instruments in action.
If you don’t see the system you’re interested in learning about, let us know! We would be happy to arrange a separate demonstration with the most appropriate equipment.
TESCAN SEM
Scanning electron microscopy is a well-known non-destructive technique that uses an electron beam probe to analyze a sample’s surface down to nano-scale. The scanning electron microscope produces high magnification images with high resolution, which makes the technique suitable for a wide range of applications and in numerous fields of science and industry.
TESCAN FIB-SEM
The focused ion beam scanning electron microscope (FIB-SEM) is a two-column system that incorporates both electron and ion columns. The FIB-SEM system is configured so that the electron and ion beam focal points coincide, resulting in the optimization of many applications. Such a feature enables simultaneous SEM imaging during FIB milling tasks – a significant leap in terms of performance and throughput in all those FIB operations that demand ultimate levels of precision.
TESCAN MICRO-CT
TESCAN’s Dynamic micro-CT technology enables the identification of complex, microscopic events within your sample through time-correlated observation of physical changes, and it achieves this in real-time. TESCAN’s true 4D Dynamic micro-CT is not just an extension of traditional 3D-based x-ray tomography or simple 3D time-lapse of x-ray images. TESCAN Dynamic micro-CT solutions are offering real-time, complex in-situ dynamic micro-CT capabilities, recording and visualizing a multitude of physical processes.