TESCAN AMBER X

A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization

Home Product Portfolio TESCAN FIB-SEM Solutions for Materials Science TESCAN AMBER X

High throughput, large area FIB processing up to 1 mm
Ga-free microsample preparation
Ultra-high resolution, field-free FEG-SEM imaging and analysis
In-lens SE and BSE detection

Resolution optimization for high-throughput, multi-modal FIB-SEM tomography
Superior field of view for easy navigation
Essence™ easy-to-use, modular graphical user interface

: 1 mm wide polished cross section of a Li-ion battery electrode

: EBSD map of a 90 µm diameter cold-drawn copper wire

: Ga-free atom probe tip sample preparation using plasma FIB

TESCAN Webinars:

Take your multi-modal materials characterization further with our latest plasma FIB-SEM

Innovative FIB/SEM Lift-out Solutions for Advanced TEM Lamella Preparation Requirements

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TESCAN AMBER X

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Product Flyer

TESCAN AMBER X

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