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TESCAN AMBER X

A unique combination of Plasma FIB and field-free UHR FE-SEM for multiscale materials characterization

  • High throughput, large area FIB processing up to 1 mm
  • Ga-free microsample preparation
  • Ultra-high resolution, field-free FEG-SEM imaging and analysis
  • In-lens SE and BSE detection

  • Resolution optimization for high-throughput, multi-modal FIB-SEM tomography
  • Superior field of view for easy navigation
  • Essence™ easy-to-use, modular graphical user interface

TESCAN Webinars:

Take your multi-modal materials characterization further with our latest plasma FIB-SEM

Innovative FIB/SEM Lift-out Solutions for Advanced TEM Lamella Preparation Requirements

  • Product Brochure

    TESCAN AMBER X

    pdf 3 MB Download
  • Product Flyer

    TESCAN AMBER X

    pdf 880 KB Download
Get in touch

Do you wish to discuss TESCAN AMBER X? Contact our Team directly!