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TESCAN AMBER X

Optimized plasma FIB-SEM platform for high-quality deprocessing of the most modern semiconductor devices with proprietary chemistries

  • Low-kV high-resolution imaging with enhanced topographic contrast of target layers
  • Imaging of edges of delayered or cleaved chips using field-free high-resolution technology
  • Dedicated and proprietary gas chemistries for sub-14 nm nodes deprocessing

  • End-pointing software module for semiautomated deprocessing enables stopping the process at a desired layer
  • Electrical characterization of the most sensitive semiconductor devices using in-situ nanoprobing
  • Easy-to-use, fully customizable, applicationoriented and modular user interface

  • Product brochure

    TESCAN AMBER X

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