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TESCAN MIRA3

High throughput analytical FEG-SEM for materials characterization at sub-micron scale

  • SEM analysis and industrial inspection of materials at sub-micron scale
  • High-quality images can be obtained after minimum training
  • Fast setup of the electron beam – optimal imaging conditions are guaranteed by the In-Flight Beam Tracing™
  • Intuitive live SEM navigation on the sample at magnification as low as 2× without the need of extra optical navigation camera thanks to the unique Wide Field Optics™ design
  • DEPTH imaging mode for highly-topographic samples, fibers, or fractured surfaces
  • In-beam and In-chamber detectors for sub-microanalysis
  • Tool for correlative navigation always available as a standard feature
  • UniVac option for observation of charging and beam-sensitive samples
  • High performance at attractive cost of ownership 
  • Product brochure

    TESCAN MIRA3

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