Microelectromechanical systems (MEMS) can be defined as miniaturised mechanical and electromechanical elements (i.e., devices and structures) that are made using the techniques of microfabrication. There are, however, considerable challenges in the fabricating and packaging such devices. Diverse issues related to yield and reliability need to be overcome. For this purpose, large-area cross-sections at specific locations on the MEMS device need to be prepared. The new TESCAN S8000X is a Xe ion plasma focused ion beam scanning electron microscope (FIB-SEM) that provides an effective solution to prepare artefact-free large-area cross-sections on MEMS for the purposes of failure analysis of these devices.
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