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TESCAN introduces a new cutting-edge technology for uncompromised imaging capabilities

TESCAN is proud to announce the launching of the second generation of its ultra-high resolution electron column.

TESCAN introduces a new cutting-edge technology for uncompromised imaging capabilities

The new column achieves superb ultra-high resolution without any compromises: 0.7 nm at 15 keV and 1 nm at 1 keV.

Equipped with a newly designed and innovative electron optics, and an advanced and robust detection system, the new column provides scientists and technologists with ultimate surface sensitivity and outstanding contrast at low beam energies to resolve nano-sized features of beam high-sensitive or non-conductive samples.

The column excels in the whole range of accelerating voltage, however, the highlight is the ultimate resolution at low beam energies which makes this new column ideal for imaging beam sensitive materials such as low-k dielectric materials, photoresists, non-conductive materials and, uncoated, fully hydrated biological specimens. In addition, the analytical potential has been significantly improved for excellent performance in the field-free mode.

M&M conference in Columbus

The formal launching of the new technology is scheduled to be on July 24-28, 2016 during the M&M conference in Columbus, Ohio, USA. We invite you to join us in this event and take part in live demos of our microscopes equipped with this new technology. Come and discuss with our team of expert application specialists and find out more about TESCAN technologies, techniques and applications.

More detailed information on this technology will be released soon, so stay tuned!

20.06.2016