Advanced packaging technologies have been developed as a solution to pursue higher functionality, higher density and lower power consumption. Failure analysis of integrated circuit packaging usually requires preparing large area cross-sections. The new TESCAN S8000G FIB-SEM is equipped with the novel Orage™ Ga FIB column capable of a maximum ion beam current of 100 nA which makes it possible to prepare large-area cross-sectioning of solder balls in an automatic and precise way. This increases throughput in the workflow of failure analysis in packaging technologies.
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- SEM image of solder ball cross-section taken at 2 keV using BSE detector showing excellent material contrast.