TESCAN Webinar:
TESCAN Plasma FIB-SEM for multi-modal materials characterization
On demand
ENGLISH
Recent developments of new materials and manufacturing technologies are imposing new requirements for materials characterization. Acquiring complete information about material microstructure and its relation to mechanical or physical properties often requires a multi-scale characterization approach involving multiple analytical techniques.
In this webinar you will learn about:
- TESCAN FIB-SEM solutions that combine high-resolution SEM imaging with a broad range of microanalytical techniques, including EDS, WDS, EBSD, Raman, or TOF-SIMS.
- TESCAN Xe plasma FIB technology for high throughput, large area ion milling of cross-sections, up to 1 mm, as well as routine milling and polishing operations for sample preparation.
- TESCAN AMBER X with field-free UHR-SEM optics with the Xe plasma FIB provides high throughput, large area 2D cross sectioning and 3D multi-modal characterization capabilities for advanced materials research.
Please join use to learn about FIB-SEM multi-scale characterization capabilities in the video below.
Presenter: Dean Miller PhD
About Dean Miller PhD
Principal Scientist. Dean Miller received his B.S. in Metallurgical Engineering and Ph.D. in Materials Science, both from the University of Illinois in Champaign-Urbana. He was a Senior Materials Scientist at Argonne National Laboratory for 30 years, including serving as Director for the Electron Microscopy Center at Argonne. His research focuses on the characterization of complex electronic oxides including advanced battery materials, magnetic oxides, and high-temperature superconductors with a particular emphasis on characterization by electron beam methods.