Stay Ahead with the Latest in Electron Microscopy

Learn how to reduce EBL stitching errors on a standard SEM using technological layers and smart write-field placement in a GDSII workflow.

Learn practical methods to estimate lamella thickness for TEM, including FIB-SEM transparency, EELS-based measurement, and X-mark polishing techniques.

An interview with Riley Tejcek on performance and safety, including how non-destructive X-ray CT supports materials inspection in demanding environments.

Dr. Tatiana Gorelik shares insights on 3D electron diffraction, data acquisition strategies, and how new instrumentation shapes crystallography research.

Carlyle and Shimadzu Corporation have signed an agreement under which Tescan would become part of Shimadzu, subject to regulatory and customary approvals. The transaction has not yet closed.

The University of Defence in Brno installs Tescan UNITOM XL microCT for ballistic protection, composite materials research, and advanced 3D material analysis.

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

Tescan and Wirsam co-hosted a hands-on Mineralogy Workshop in Johannesburg, uniting TIMA users to share insights on automated mineralogy and data optimization.

Discover the main topics of iCT 2026 in Linz and how Tescan will share new ways to improve micro-CT imaging, workflows, and research outcomes.

See the key trends from ISTFA 2025, including advances in semiconductor failure analysis, laser sample preparation, and workflow improvements for modern devices.

Czech Technical University enhances construction materials research with the Tescan AMBER X FIB-SEM, unlocking advanced microstructure analysis and 3D tomography capabilities.

Tescan UK will join the SEMT Meeting 2025 at the Natural History Museum in London, connecting with the microscopy community to discuss imaging workflows and innovations.

SGS celebrates the 100th TESCAN TIMA installation in Chile, advancing automated mineralogy and high-throughput mineral characterization.

Tescan showcased new technologies, AMBER X2, and TENSOR at the National CEMS Conference 2025, highlighting innovation in electron microscopy and workflow efficiency.

Tescan and Dragonfly Energy showcase how advanced microscopy and data analytics accelerate lithium-ion battery innovation and sustainable manufacturing.

Dr. Jana Jurmanová from Masaryk University discusses how the TESCAN CLARA electron microscope supports materials research and student training.

Tescan joins Mikrolux at the 32nd Annual Meeting of the Croatian Microscopy Society in Zagreb to connect with researchers and share innovations.

Tescan supports the new Plasma FIB-SEM laboratory at CTU Prague, advancing materials science research and innovation in civil engineering.

Discover how Tescan’s cryo-electron microscopy workflow helped uncover algae’s adaptive response to ZnO nanoparticles in collaboration with Mendel University.

Tescan will join the Cryo-Microscopy Group Meeting at the University of Nottingham to showcase its Cryo SOLARIS X² system and latest cryo-microscopy innovations for life sciences.

Discover how Tescan showcased its latest developments in TEM lamella preparation, 4D-STEM analysis, and energy materials research at the CMC Workshop 2025.

Discover how Tescan’s workflow integration and regional expansion are transforming semiconductor analysis and packaging. Watch the DIGITIMES interview with Hervé Macé and Sean Lee.

Highlights from the 3rd Tescan Collaboration Network Meeting at ER-C

TESCAN joins October events in Heidelberg and Bochum — showcasing solutions for life sciences imaging and materials research. Visit our booths & talks.

University of Leeds and RMS hosted a 4D-STEM & 3D-ED workshop, featuring TENSOR demos, keynotes from global experts, and interactive scientific sessions.

Tescan Group today announced the acquisition of FemtoInnovations and the creation of a dedicated Laser Technology Business Unit (LT BU).

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

At IPFA 2025, Tescan presented cutting-edge FIB-SEM & Micro-CT platforms solving semiconductor failure analysis, yield, and reliability challenges.

TESCAN’s AMBER X 2 Plasma FIB-SEM wins the 2025 R&D 100 Award for combining high-throughput 3D analysis with nanometer-precision TEM specimen prep.

Tescan Group proudly introduces its new global brand platform The Art of Discovery at this year’s Microscopy Conference (MC) in Karlsruhe, Germany.

TESCAN will co-host a collaborative webinar with the University of Leeds, presenting a low-dose 4D-STEM methodology for characterising beam-sensitive polymers and soft matter.

Tescan introduces AutoSection and TEM AutoPrep PRO at M&M 2025 - accelerating semiconductor workflows through precision automation and user-friendly software.