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February 24, 2026

From Structural to Functional Insights: Professor Andy Brown on Beam-Sensitive Materials and 4D-STEM

Discover how 4D-STEM and TESCAN TENSOR enable dose-efficient analysis of beam-sensitive materials, advancing electron diffraction and structural research.

February 16, 2026

Tescan UniTOM XL Dynamic CT Beam Time competition

Submit your proposal for one week of dynamic X-ray CT beam time on Tescan UniTOM XL in Warrendale, PA. Deadline: 31 March 2026.

Feb 12

Micro-CT and Plasma FIB-SEM Workflows for Multiscale Characterization of Heterogeneous Materials

Discover how integrating micro-CT and plasma FIB-SEM enables multiscale 3D characterization of heterogeneous materials, linking structure, and performance.

Feb 12

How to Reduce EBL Stitching in Critical Features on a Standard SEM

Learn how to reduce EBL stitching errors on a standard SEM using technological layers and smart write-field placement in a GDSII workflow.

Jan 29

Lamella Preparation with Precise Thickness Estimation

Learn practical methods to estimate lamella thickness for TEM, including FIB-SEM transparency, EELS-based measurement, and X-mark polishing techniques.

Jan 15

Riley Tejcek: Team USA Bobsled Pilot, U.S. Marine Corps Captain, and Author

An interview with Riley Tejcek on performance and safety, including how non-destructive X-ray CT supports materials inspection in demanding environments.

Jan 05

$3D electron diffraction$

From Early Methods to Today’s Challenges: Dr. Gorelik on 3D-ED

Dr. Tatiana Gorelik shares insights on 3D electron diffraction, data acquisition strategies, and how new instrumentation shapes crystallography research.

Jan 05

Update on Agreement Signed between Carlyle and Shimadzu Corporation

Carlyle and Shimadzu Corporation have signed an agreement under which Tescan would become part of Shimadzu, subject to regulatory and customary approvals. The transaction has not yet closed.

Jan 02

Tescan's First Micro-CT Installation in Czech Academia: UniTOM XL at the University of Defence

The University of Defence in Brno installs Tescan UNITOM XL microCT for ballistic protection, composite materials research, and advanced 3D material analysis.

Dec 30

TESCAN ORAGE 2 in Action: Smarter, Faster, and More Reliable TEM Lamella Preparation.

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

Dec 30

Tescan & Wirsam Host TIMA Mineralogy Workshop

Tescan and Wirsam Host Successful Mineralogy Workshop for TIMA Users in South Africa

Tescan and Wirsam co-hosted a hands-on Mineralogy Workshop in Johannesburg, uniting TIMA users to share insights on automated mineralogy and data optimization.

Dec 17

UniTOM HR 2 Ecosystem Introduced at iCT 2026: Dynamic-to-Detail Micro-CT With In-Situ Continuity

Discover the main topics of iCT 2026 in Linz and how Tescan will share new ways to improve micro-CT imaging, workflows, and research outcomes.

Dec 17

ISTFA 2025: Complete Event Overview and How Tescan Stood Out

See the key trends from ISTFA 2025, including advances in semiconductor failure analysis, laser sample preparation, and workflow improvements for modern devices.

Dec 12

CTU Advances Construction Materials Research with Tescan AMBER X

Enhances Construction Materials Research Through Tescan FIB-SEM Technology

Czech Technical University enhances construction materials research with the Tescan AMBER X FIB-SEM, unlocking advanced microstructure analysis and 3D tomography capabilities.

Dec 02

Society of Electron Microscope Technology (SEMT)

Tescan to attend the SEMT Meeting 2025 at the Natural History Museum in London

Tescan UK will join the SEMT Meeting 2025 at the Natural History Museum in London, connecting with the microscopy community to discuss imaging workflows and innovations.

Nov 27

SGS Chile team and Tescan representatives during the ribbon-cutting ceremony for the 100th TIMA installation.

SGS in Chile Celebrates Installation of the 100th Tescan TIMA Mineral Analyzer in high throughput configuration

SGS celebrates the 100th TESCAN TIMA installation in Chile, advancing automated mineralogy and high-throughput mineral characterization.

Nov 27

National CEMS Conference 2025: Tescan Highlights Innovation in Electron Microscopy

Tescan showcased new technologies, AMBER X2, and TENSOR at the National CEMS Conference 2025, highlighting innovation in electron microscopy and workflow efficiency.

Nov 25

Accelerating Battery Innovation with Advanced Analytics

Tescan and Dragonfly Energy showcase how advanced microscopy and data analytics accelerate lithium-ion battery innovation and sustainable manufacturing.

Nov 25

Tescan CLARA Electron Microscope: A Universal Tool for Broad University-Level Research

Dr. Jana Jurmanová from Masaryk University discusses how the TESCAN CLARA electron microscope supports materials research and student training.

Nov 20

Tescan and Mikrolux at the 32nd Annual Meeting of the Croatian Microscopy Society

Tescan joins Mikrolux at the 32nd Annual Meeting of the Croatian Microscopy Society in Zagreb to connect with researchers and share innovations.

Nov 19

New Laboratory Opening at CTU Prague: A Step Forward in Materials Science

Tescan supports the new Plasma FIB-SEM laboratory at CTU Prague, advancing materials science research and innovation in civil engineering.

Nov 14

Algal Secrets: How Tescan’s Cryo Workflow Enabled Insight into Green Algae Response to ZnO Nanoparticles

Discover how Tescan’s cryo-electron microscopy workflow helped uncover algae’s adaptive response to ZnO nanoparticles in collaboration with Mendel University.

Nov 11

Tescan at the Cryo-Microscopy Group Meeting – University of Nottingham, 12 November 2025

Tescan will join the Cryo-Microscopy Group Meeting at the University of Nottingham to showcase its Cryo SOLARIS X² system and latest cryo-microscopy innovations for life sciences.

Oct 31

Tescan at the CMC Workshop 2025: Advancing Materials Characterization and Collaboration

Discover how Tescan showcased its latest developments in TEM lamella preparation, 4D-STEM analysis, and energy materials research at the CMC Workshop 2025.

Oct 30

Smarter Workflows and Closer Collaboration: Tescan at SEMICON Taiwan 2025

Discover how Tescan’s workflow integration and regional expansion are transforming semiconductor analysis and packaging. Watch the DIGITIMES interview with Hervé Macé and Sean Lee.

Oct 20

Highlights from the 3rd Tescan Collaboration Network Meeting at ER-C

Sep 29

This October with Tescan: From Molecular Life Imaging to Metallography Insights

TESCAN joins October events in Heidelberg and Bochum — showcasing solutions for life sciences imaging and materials research. Visit our booths & talks.

Sep 25

4D-STEM Workshop at the University of Leeds

University of Leeds and RMS hosted a 4D-STEM & 3D-ED workshop, featuring TENSOR demos, keynotes from global experts, and interactive scientific sessions.

Sep 24

University of Sydney and Tescan Explore New Frontiers in TEM Sample Preparation

Tescan Group today announced the acquisition of FemtoInnovations and the creation of a dedicated Laser Technology Business Unit (LT BU).

Sep 19

EXLO in Action: Fast, Reliable and Scalable TEM Specimen Preparation

Remove bottlenecks in TEM workflows by taking lift-out outside the FIB-SEM and into a dedicated EXLO station

Sep 16

Tescan at IPFA 2025 Semiconductor Failure Analysis, FIB-SEM & Micro-CT Solutions

At IPFA 2025, Tescan presented cutting-edge FIB-SEM & Micro-CT platforms solving semiconductor failure analysis, yield, and reliability challenges.

Sep 01

AMBER X 2 Wins 2025 R&D 100 Award for Plasma FIB-SEM Innovation

TESCAN’s AMBER X 2 Plasma FIB-SEM wins the 2025 R&D 100 Award for combining high-throughput 3D analysis with nanometer-precision TEM specimen prep.

Aug 31

Tescan at MC 2025: Accelerating the Art of Discovery

Tescan Group proudly introduces its new global brand platform The Art of Discovery at this year’s Microscopy Conference (MC) in Karlsruhe, Germany.

Aug 27

TESCAN & University of Leeds Webinar on Low-Dose 4D-STEM

Tescan and the University  of Leeds to Host Exclusive Webinar on Low-Dose 4D-STEM for Soft Matter Analysis

TESCAN will co-host a collaborative webinar with the University of Leeds, presenting a low-dose 4D-STEM methodology for characterising beam-sensitive polymers and soft matter.

Jul 29

TESCAN at M&M 2025: Client Needs are at the Core of Everything We Do

Tescan introduces AutoSection and TEM AutoPrep PRO at M&M 2025 - accelerating semiconductor workflows through precision automation and user-friendly software.

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