New systems enhance semiconductor research with automated TEM lamella preparation, advanced failure analysis, and precision delayering with in-situ electrical analysis.
Brno, Czech Republic – TESCAN GROUP, a global leader in scientific instrumentation, announces the launch of three advanced systems: SOLARIS 2, SOLARIS X 2, and AMBER X 2. These solutions are developed to meet the increasing demands of semiconductor failure analysis, offering automation, precision, and efficiency for sub-10 nm technology nodes and beyond.
To provide further insights into these new systems, TESCAN will be hosting a webinar on Mon, Oct 21, 2024 5:00 PM – 6:00 PM CEST.
From October 28 to November 1, TESCAN experts will also be available at ISTFA 2024 in San Diego, California, to discuss these innovations and their applications in semiconductor analysis.
TESCAN SOLARIS 2: AI-Driven TEM Lamella Preparation
The TESCAN SOLARIS 2 is designed for fully automated TEM lamella preparation using the AI-powered TESCAN TEM AutoPrep™ Pro software. This system produces high-quality, ultra-thin samples for sub-10 nm technology nodes, such as advanced logic and memory devices.
Key features include:
- Fully Automated TEM Lamella Preparation: AI-driven precision delivers high-quality samples with minimal damage, supporting various geometries such as top-down, planar, and inverted lamellae.
- Flexible Sample Handling: Achieve high-resolution end-pointing for advanced devices like GAA and FinFET transistors with the Triglav™ SEM column.
- User-Friendly Operation: Automated workflows reduce setup time and optimize system readiness, ensuring productivity for users at all experience levels.
TESCAN SOLARIS X 2: Ga-Free TEM Preparation and Advanced Failure Analysis
The TESCAN SOLARIS X 2 extends the capabilities of physical failure analysis with its Mistral™ Xe Plasma FIB column, providing large-area cross-sectioning and gallium-free TEM lamella preparation for complex semiconductor packages, including 2.5D, 3D IC, and MEMS devices.
Key features include:
- Large-Scale Failure Analysis: Perform deep cross-sectioning, reaching buried structures up to 1 mm in depth, using the Mistral™ Xe Plasma FIB.
- Ga-Free TEM Lamella Preparation: Produce high-quality, gallium-free lamellae, preserving sample integrity for advanced packaging applications.
- Precise Defect Targeting: The Triglav™ SEM column enables nanometer-level accuracy for defect isolation in advanced semiconductor packaging.
TESCAN AMBER X 2: Precision Delayering with In-Situ Electrical Analysis
The TESCAN AMBER X 2 provides precision delayering with uniform, artifact-free results, supporting sub-10 nm technology nodes. This system is built for electrical failure analysis, allowing in-situ verification through SEM-based nanoprobing and efficient defect isolation.
Key features include:
- Uniform, Artifact-Free Delayering: Achieve consistent results with tailored gas chemistries like Nanoflat Chase and C-maze, optimized for NMOS and PMOS transistors.
- In-Situ Electrical Analysis: SEM-based nanoprobing allows real-time characterization of electrical failures during the delayering process.
- Automated Delayering: TESCAN Delayering™ Software automates end-point determination, targeting specific layers for detailed failure analysis.
These systems are built to address the growing complexities of modern semiconductor technologies, improving the efficiency and accuracy of failure analysis for researchers and engineers.
Join Our Webinar
TESCAN is hosting an exclusive webinar, “Introduction to TESCAN’s FIB-SEM Solutions for Semiconductor Failure Analysis and R&D Laboratories,” which will offer an in-depth look into the capabilities of our platforms, including cross-sectioning, TEM preparation, and delayering.
- Date & Time: Mon, Oct 21, 2024 5:00 PM – 6:00 PM CEST
Meet Us at ISTFA 2024
TESCAN will also be present at ISTFA 2024 from October 28 to November 1, 2024, where our solutions can be experienced firsthand. Our experts will be available at booth #NUMBER to answer questions and provide insights into how our systems can enhance semiconductor failure analysis.
For more details, visit us at ISTFA or learn more on our website.
About TESCAN GROUP
TESCAN was established in 1991 and has grown from a 4-5 engineer start-up initially, to a company with more than 700 employees working from more than 10 facilities in 8 countries. We are a leading player in charged-particle optical instrumentation, including Scanning and Scanning Transmission Electron Microscopy (SEM & STEM), Focused Ion Beam (FIB) and X-ray Computed Tomography (micro-CT), with more than 4000 instruments sold and operational in more than 80 countries.
In 2013, it expanded by merging with ORSAY PHYSICS, a French global leader in customized focused ion and electron beam technologies, and in 2018 by acquiring XRE, a Belgian innovator in the field of Dynamic and micro-CT technologies. A further, more recent milestone was the acquisition in 2023 of TESCAN ORSAY HOLDING and all its subsidiaries by CARLYLE, a US private equity company. TESCAN GROUP is headquartered in Brno, Czech Republic, where most of our instruments are expertly assembled, tested, and shipped to customers across the globe.
Press Contact
For further information, interview requests, or media inquiries, please contact:
Linda Bilal, Senior Global Marketing Manager
Marketing Department
TESCAN GROUP, a.s.; Libušina tř. 21; 623 00 Brno – Kohoutovice; Czech Republic
Phone: +420 530 353 478, Email: [email protected]