A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis

  • Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
  • Prepare large area FIB-cross-sections up to 1 mm wide
  • Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
  • Live SEM-monitoring during FIB milling for precise end-pointing

  • Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
  • Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
  • Essence™ easy-to-use modular user interface

Complement TESCAN Solaris X capabilities with stand-alone laser ablation, which significantly improves time-to-result for large volume milling or access to deeply buried regions of interest, and frees the Plasma FIB for final targeted material removal, sample thinning or cross-section polishing.

TESCAN Webinar:

TESCAN SOLARIS X for Semiconductors

  • Product brochure


    pdf 8 MB Download
  • Product Flyer


    pdf 751 KB Download
  • Product Flyer

    TESCAN Large Volume Workflow

    pdf 1 MB Download
  • App note

    Extra large area cross sections in an OLED display

    pdf 548 KB Download
  • App note

    TEM specimen prepared from a 66 nm SDRAM sample using TESCAN SOLARIS X Xe plasma FIB-SEM

    pdf 922 KB Download
  • App note

    TESCAN SOLARIS X Rocking stage for high-quality polishing of cross section surfaces

    pdf 1 MB Download
Get in touch

Do you wish to discuss TESCAN SOLARIS X? Contact our Team directly!