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TESCAN SOLARIS X

A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis

  • Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
  • Prepare large area FIB-cross-sections up to 1 mm wide
  • Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
  • Live SEM-monitoring during FIB milling for precise end-pointing

  • Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
  • Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
  • Essence™ easy-to-use modular user interface

Complement TESCAN Solaris X capabilities with stand-alone laser ablation, which significantly improves time-to-result for large volume milling or access to deeply buried regions of interest, and frees the Plasma FIB for final targeted material removal, sample thinning or cross-section polishing.

TESCAN Webinar:

TESCAN SOLARIS X for Semiconductors

  • TESCAN SOLARIS X

    Product Brochure

    pdf 3 MB Download
  • TESCAN SOLARIS X

    Product Flyer

    pdf 767 KB Download
  • TESCAN LARGE VOLUME WORKFLOW

    Product Flyer

    pdf 888 KB Download
  • Estra large area cross-section in an OLED Display

    Application Note

    pdf 475 KB Download
  • TEM specimen prepared from a 66 nm SDRAM sample using TESCAN SOLARIS X Xe plasma FIB-SEM

    Application Note

    pdf 463 KB Download
  • TESCAN SOLARIS X: Rocking stage for high-quality polishing of cross section surfaces

    Application Note

    pdf 1,014 KB Download
Get in touch

Do you wish to discuss TESCAN SOLARIS X? Contact our Team directly!