Discover Tescan’s

Advanced FIB-SEM
Focused Ion Beam Scanning Electron Microscopes

Tescan FIB-SEM (Focused Ion Beam Scanning Electron Microscope) systems combine high-resolution electron imaging with precise ion beam modification to support advanced nanoscale characterization, sample preparation, and 3D analysis workflows. Designed for materials science, semiconductors, battery research, life sciences, and geoscience applications, Tescan FIB-SEM platforms help researchers move seamlessly from imaging to nanomachining, cross-sectioning, tomography, and analytical investigation within a single environment.

Users working with large or complex samples often face a trade-off between milling speed and analytical precision. Tescan FIB-SEM technologies build on long-standing expertise in focused ion beam development, including the introduction of the world’s first fully integrated Xe plasma FIB-SEM platform (Orsay Physic is part of Tescan now). This foundation continues to shape today’s workflows, enabling high-throughput large-volume processing alongside high-resolution imaging and precise nanoscale modification within a single system.

The portfolio includes both Ga focused ion beam systems for ultra-precise nanofabrication and TEM sample preparation, and Xe plasma FIB-SEM systems optimized for rapid large-volume milling and high-throughput workflows. Advanced plasma FIB technologies enable users to bridge the traditional gap between resolution and speed, supporting applications ranging from failure analysis and semiconductor process development to large-scale 3D characterization and multimodal materials analysis.

Tescan FIB-SEM solutions are engineered around modular architectures, field-free ultra-high-resolution SEM imaging, and flexible analytical integration including EDS, EBSD, ToF-SIMS, Raman, and in situ experimentation. Automated workflows for TEM lamella preparation, serial section tomography, and multidimensional correlative analysis help laboratories increase throughput while maintaining precision and reproducibility.


Not sure which FIB-SEM configuration best fits your application, workflow, or throughput requirements? Request a personalized consultation with a Tescan specialist to discuss your samples, analytical goals, and laboratory needs, and identify the solution best suited to your research or production environment. 

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Tescan AMBER™ 2

Automated Ga⁺ FIB-SEM for high-precision TEM sample prep and nanoscale prototyping

Tescan AMBER 2 gives you BrightBeam™ field-free SEM optics, the Orage™ Ga⁺ FIB, and fully automated lamella workflows for consistent, high-quality TEM sample preparation. Perform inverted and planar sample prep, nanoprocessing, and gentle final polishing across a wide range of materials.

Key benefits

  • Automated TEM lamella prep: Guided workflows support consistent, reproducible preparation—including lift-out—across skill levels.
  • Lower-damage polishing: The optional Argon Gentle Ion Beam™ (<200 eV) protects sensitive materials during final polishing.
  • Nanoscale fabrication capability: Integrated FIB milling, e-beam lithography, and material deposition give you flexible prototyping options.
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Tescan AMBER X™ 2

Plasma FIB-SEM for fast, low-damage sample prep and 3D multimodal analysis

AMBER X 2 gives you Mistral™ Xe Plasma FIB and BrightBeam™ UHR SEM to handle both large-volume sectioning and delicate TEM lamella prep. Support multimodal workflows—including EDS, EBSD, ToF-SIMS, and Raman—across hard, soft, or beam-sensitive materials.

Key benefits

  • High-throughput milling: Xe ions provide curtaining-free large-volume milling and support precise TEM lamella prep.
  • Streamlined 3D workflows: Integrated hardware and automation accelerate correlative SEM, FIB, and mass-spectrometry analysis.
  • Reduced system overhead: A single platform combines 3D tomography, TEM prep, and multimodal analytics to simplify your workflow.
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Tescan SOLARIS™ 2

Dedicated Ga⁺ FIB-SEM for automated, high-precision TEM sample prep in semiconductor workflows

Tescan SOLARIS 2 gives you a fully automated sample prep platform optimized for advanced devices with sub-10 nm features. Integrate the Triglav™ SEM, AutoTEM Pro™ software, and the OptiLift™ nanomanipulator to enable hands-free, repeatable lamella prep in planar, inverted, or top-down geometries.

Key benefits

  • Higher repeatability: AI-driven, automated lamella prep workflows increase throughput with minimal operator input.
  • More precise end-pointing: Triglav™ SEM and in-column detectors let you target nanoscale defects at beam coincidence.
  • Less downtime: Overnight auto-alignments and unattended batch processing keep your tool productive.
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Tescan SOLARIS X™ 2

Plasma FIB-SEM for high-throughput semiconductor failure analysis and Ga⁺-free sample prep

SOLARIS X  2 gives you Mistral™ Xe Plasma FIB, UHR SEM imaging, and artifact-free Rocking Stage cross-sectioning for modern failure-analysis workflows. Support fast defect localization, Xe-based TEM prep, and processing of complex stacks and packaging.

Key benefits

  • Curtaining-free cross-sections: TRUE X-sectioning delivers deep, high-current cross-sections in heterogeneous stacks and polymers.
  • Ga+-free TEM prep: A fast, inert Xe plasma FIB system offloads high-volume TEM prep and frees capacity on conventional Ga+ FIBs.
  • Standardized FA workflows: Intuitive end-pointing, automated alignment, and guided wizards improve speed and repeatability. 

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Where can you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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