An alternative solution for semi-automated high-quality TEM lamella preparation
Low-kV ultra-high-resolution imaging of high-end semiconductor devicesPrecise end-pointing at low electron beam energiesGentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performanceOptimized workflows and recipes for easy preparation of ultra-thin TEM lamellaeSemi-automated software module for site-specific TEM lamella preparationPreparation of advanced geometry TEM lamellae from the most advanced semiconductor nodesSpecialized, load-lock-compatible stage carousel for TEM sample preparationDedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation
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High-resolution 3D reconstructionof 3D NAND memory using TESCAN SOLARIS
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