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TESCAN SOLARIS

An alternative solution for semi-automated high-quality TEM lamella preparation

  • Low-kV ultra-high-resolution imaging of high-end semiconductor devices
  • Precise end-pointing at low electron beam energies
  • Gentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performance
  • Optimized workflows and recipes for easy preparation of ultra-thin TEM lamellae

  • Semi-automated software module for site-specific TEM lamella preparation
  • Preparation of advanced geometry TEM lamellae from the most advanced semiconductor nodes
  • Specialized, load-lock-compatible stage carousel for TEM sample preparation
  • Dedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation

TESCAN Webinar:

Prepare Top-down, Inverted and Planar TEM lamella from Logic and Memory Devices

  • TESCAN SOLARIS

    Product Brochure

    pdf 6 MB Download
  • App note

    High-resolution 3D reconstructionof 3D NAND memory using TESCAN SOLARIS

    pdf 3 MB Download
  • Gas-assisted gallium FIB delayering of sub-20 nm node technologies with TESCAN SOLARIS

    Application Note

    pdf 537 KB Download
  • TESCAN SOLARIS

    Product Flyer

    pdf 644 KB Download
Get in touch

Do you wish to discuss TESCAN SOLARIS? Contact our Team directly!