X-ray ptychography – a high-resolution coherent diffractive imaging technique – was used to create three-dimensional images of complex multilayered integrated circuits with unmatched lateral resolution. The TESCAN FE-SEM Xe plasma FIB FERA3 system was used during the preparation process of the analysed samples.
High-resolution non-destructive 3D imaging of integrated circuits
TESCAN Xe plasma FIB-SEM FERA3, an essential tool for sample preparation