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High-resolution non-destructive 3D imaging of integrated circuits

TESCAN Xe plasma FIB-SEM FERA3, an essential tool for sample preparation

High-resolution non-destructive 3D imaging of integrated circuits

X-ray ptychography – a high-resolution coherent diffractive imaging technique – was used to create three-dimensional images of complex multilayered integrated circuits with unmatched lateral resolution. The TESCAN FE-SEM Xe plasma FIB FERA3 system was used during the preparation process of the analysed samples.

Original source

16.03.2017