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Non-destructive inspection of semiconductor devices

High resolution large format imaging for die inspection with TESCAN Image Snapper Software

Non-destructive inspection of semiconductor devices

Visual inspection is an integral part of the production line in all semiconductor foundries. Most of the inspection tech­niques currently in use are optical-based which will face a resolution limit due to the continual reduction in the size of dies. TESCAN’s Image Snapper is a perfect substitution allowing non-destructive imaging based on the stitching of high-magnification images resulting in one high-resolution panorama image.

Download the new TESCAN Application Example and find out more on this.

23.05.2018
  • High resolution large format imaging for die inspection

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