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TESCAN solution for large wafer inspection

High Resolution Large Format Imaging for Die Inspection

TESCAN solution for large wafer inspection

Most of the inspection techniques currently in use are optical-based which will face a resolution limit due to the continual reduction in the size of dies. TESCAN’s Image Snapper is a perfect substitution allowing nondestructive imaging based on the stitching of high magnification images resulting in one high resolution panorama image.

 

09.03.2017
  • High resolution large format imaging for die inspection

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