Advances in Li-ion battery research using TESCAN instruments
High-Coulombic-Efficiency Carbon/Li Clusters Composite Anode without...
Composite wind blade engineering
Multi-resolution 3D X-ray CT investigation of porosity from macro to micro...
Non-destructive Failure Analysis in Semiconductors
Quantification of TSV misalignments with high resolution micro-CT &ndash...
China’s First TIMA-X Installed at Peking University – Geology Department
TESCAN is proud to announce that they have installed the first TIMA-X...
Characterization of metal wires with the new TESCAN S8000X Xe+ plasma FIB-SEM
Microstructure Anisotropy Study of Cold-Drawn Wires using 3D EBSD and Xe...
Advanced failure analysis in FinFET-based devices with the new TESCAN S9000G FIB-SEM
Gas-assisted gallium FIB delayering of sub-20 node technologies with TESCAN...
Redefining large-area FIB cross-sectioning with the new TESCAN S8000X plasma FIB-SEM
Physical Failure Analysis in a MEMS motion sensor: 1 mm-wide cross-section
FIB-SEM Tomography of Biological Specimens with the new TESCAN S9000G
Advanced Focused Ion Beam-Scanning Electron Microscopy for 3D ultrastructural...

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Multi-national company established by the merger of the Czech company TESCAN and the French company ORSAY PHYSICS.
Q-PHASE for quantitative phase imaging (QPI)

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